It has shiny solder joints similar to tin-lead. With zero silver, it offers a significant cost advantage over SAC305. Another alloy adopted was Kester’s K100LD. 3% Silver in SAC-305 has several benefits: Lower melting temp, lower surface tension for excellent wetting and hole-fill, and high thermal fatigue resistance. When the migration to lead-free solder started, the primary lead-free alloy used was SAC305. SAC alloys: S= Sn (tin), A= Ag (silver), C= Cu (copper). The numbers such as 63/37 or 62/36/2 refer to the alloying element amounts in percentages, with Tin listed first. Sn (Tin), Ag (Silver), Cu (Copper), Pb (Lead), Bi (Bismuth), Ni (Nickel) SOLDER ALLOYS for WAVE & SELECTIVE SOLDERING Please reference ALPHA Tape & Reel Preform Tech Bulletin for more details.Īvailable in Kester’s lead-free and leaded alloys in stampings (washers, discs, squares, rectangles, and custom shapes) and cutoffs (squares, rectangles and pellets)Īvailable in Kester’s lead-free and leaded alloys in widths from 0.050-1.0” (1.27-25.4mm) and thicknesses from 0.005-0.060” (0.127-1.52mm) Available in SAC305, Sn63Pb37, SnBiAg0.4 (low temp, lead-free) and other alloys. to selectively increase solder volume on a SMT pad or through-hole component. Solid solder alloy in standard, chip capacitor sizes: such as 0402, 0603, 0805, etc. Water-soluble paste with consistent printing characteristics and superior wetting performance. Available in both leaded and lead-free alloys. Ideal for mixed-alloy applications where lead-free BGAs are placed using leaded paste. No-clean paste with high activity for difficult soldering applications. Capable of reflowing 01005 components in air with minimal graping behavior. Zero-halogen, no-clean paste with a wide process window ideal for low-volume, high-mix EMS. Sn42Bi57Ag1 is a low-temperature offering. Versatile no-clean general purpose application paste. Sn42Bi57Ag1 alloy with liquidus of 138☌ allows a peak temperature as low as 160☌.ĭispensable water-soluble paste with superior wetting performance. Zero-halogen, no-clean low temperature paste. Zero-halogen, water-soluble paste with a stable formula providing consistent print performance over a wide humidity range. Consistent print performance through a wide range of print parameters, temperatures and humidity. Zero-halogen, no-clean paste designed specifically for high reliability applications. Also available in a 100g syringe for dispensing applications. Halogen-free, no-clean, ultra-low voiding paste for bottom terminated components with the ability to achieve <5% voiding. Zero-halogen, no-clean paste with a wide process window ideal for low-volume/high-mix EMS, or high-volume. No-clean flux core choice for leaded builds -EMS, OEM and contract manufacturing, PCB assembly, energy, automotive, aerospace, medicalĪctivated Rosin Flux Designed for Instant Wetting Action -energy, automotive, aerospace, medical, general manufacturing, electrical, industrial, fabrication High activity, water-soluble for soldering difficult metals -consumer goods/appliances, electrical, industrial, military, medical, aerospace, energy, transportationĪctivated rosin flux developed for lead-free applications -energy, automotive, aerospace, medical, general manufacturing, electrical, industrial, fabrication Zero-halogen cored wire for robotic soldering -EMS, OEM and contract manufacturing, PCB assembly electronics manufacturing Superior wetting no-clean flux-EMS, OEM and contract manufacturing, PCB assembly, energy, automotive, aerospace, medical Note – For all fluxes in this Guide, NO-CLEAN appears in Black WATER-SOLUBLE appears in Blue. Kester Brand Products - 2020 Quick Reference Guide
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